Color measurement apparatus

ABSTRACT

A color measurement apparatus includes an opening portion forming member that is a member in which an opening portion for causing light arriving from a measurement target to enter inside the apparatus is formed, and that is arranged on a bottom surface at a time of measurement performed by the apparatus, the opening portion for causing the light arriving from the measurement target to enter inside the apparatus, an incident light processing portion that processes light incident through the opening portion, and an operation portion that is positioned on an upper surface, and that receives various operations, in which in a view from a first direction that is a vertical direction intersecting with the bottom surface and the upper surface which is the surface on the opposite side from the bottom surface and includes a display portion, the opening portion and the operation portion have an overlapping part.

The present application is based on, and claims priority from JPApplication Serial Number 2020-188439, filed Nov. 12, 2020, thedisclosure of which is hereby incorporated by reference herein in itsentirety.

BACKGROUND 1. Technical Field

The present disclosure relates to a color measurement apparatus thatperforms color measurement based on light arriving from a measurementtarget.

2. Related Art

In the related art, color measurement apparatuses that measure colorbased on light arriving from a measurement target are known. Among thecolor measurement apparatuses, for example, there is a color measurementapparatus that performs color measurement by causing light arriving froma measurement target to be incident on a spectroscopic filter,extracting a predetermined wavelength component using the spectroscopicfilter and receiving the predetermined wavelength component using aphoto diode, and detecting a voltage output from the photo diode. Insuch a color measurement apparatus, an opening portion is disposed on abottom surface of an apparatus main body. Accordingly, at a time ofmeasurement, a measured part of the measurement target is in a state ofbeing covered with the apparatus main body. Thus, a problem ofpositioning between the opening portion and the measured part arises.

An optical measurement device disclosed in JP-A-2003-344164 includes alight source, a mirror that further reflects measurement light which isemitted from the light source and reflected by a measurement target, alight condensing lens that is arranged along an optical path of themeasurement light reflected by the mirror and condenses the measurementlight reflected by the mirror, a light reception element that includes alight reception surface on a rear side focal plane of the lightcondensing lens and outputs a light reception signal corresponding tothe measurement light received on the light reception surface, and afinder arranged at a position with the mirror interposed between ameasurement position and the position. The mirror is arranged to bemovable such that an inclination thereof can be adjusted. The measuredpart of the measurement target can be checked from the finder throughthe mirror.

In addition, an optical characteristic measurement apparatus disclosedin International Publication No. 2017/195573 includes a measurementtarget observation portion in which a measurement target facing ameasurement opening is directly observed, and an observation lightsource that illuminates the measurement target facing the measurementopening. Accordingly, it is configured that the measured part of themeasurement target can be directly checked without using the mirrordisclosed in JP-A-2003-344164. However, a shutter mechanism that opensand closes a through opening which is the measurement target observationportion is disposed such that extraneous light does not enter from themeasurement target observation portion at a time of measurement.

In a configuration in which the mirror as disclosed in JP-A-2003-344164or the shutter mechanism as disclosed in International Publication No.2017/195573 is disposed in order to position the opening portion on thebottom surface of the apparatus to the measured part, a noticeableincrease in cost of the apparatus is caused, and it is desirable toeasily position the opening portion to the measured part with a simplerconfiguration.

SUMMARY

According to an aspect of the present disclosure, there is provided acolor measurement apparatus including an opening portion forming memberthat is a member in which an opening portion for causing light arrivingfrom a measurement target to enter inside the apparatus is formed, andthat is arranged on a bottom surface at a time of measurement performedby the apparatus, an incident light processing portion that processeslight incident through the opening portion, and an operation portionthat is positioned on an upper surface which is a surface on an oppositeside from the bottom surface, and that receives various operations, inwhich in a view from a first direction that is a vertical directionintersecting with the bottom surface and the upper surface which is thesurface on the opposite side from the bottom surface and includes adisplay portion, the opening portion and the operation portion have anoverlapping part.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating functions of a color measurementapparatus.

FIG. 2 is a cross-sectional view of an optical filter device.

FIG. 3 is a perspective view of the color measurement apparatus viewedfrom above.

FIG. 4 is a perspective view of the color measurement apparatus viewedfrom below.

FIG. 5 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 6 is a plan view of the color measurement apparatus viewed frombelow.

FIG. 7 is a perspective view of a main body assembly.

FIG. 8 is a perspective view illustrating arrangement of each circuitsubstrate and a battery from above.

FIG. 9 is a perspective view illustrating arrangement of each circuitsubstrate and the battery from below.

An upper part of FIG. 10 is a perspective view illustrating an uppersurface of a panel substrate, and a lower part of FIG. 10 is aperspective view illustrating a lower surface of the panel substrate.

An upper part of FIG. 11 is a perspective view illustrating an uppersurface of a battery control substrate, and a lower part of FIG. 11 is aperspective view illustrating a lower surface of the battery controlsubstrate.

An upper part of FIG. 12 is a perspective view illustrating an uppersurface of a light reception portion substrate, and a lower part of FIG.12 is a perspective view illustrating a lower surface of the lightreception portion substrate.

An upper part of FIG. 13 is a perspective view illustrating an uppersurface of a light emission portion substrate, and a lower part of FIG.13 is a perspective view illustrating a lower surface of the lightemission portion substrate.

FIG. 14 is a perspective view of a frame assembly viewed from above.

FIG. 15 is a perspective view of the frame assembly viewed from below.

FIG. 16 is a perspective view of the frame assembly viewed from above.

FIG. 17 is an exploded perspective view of the frame assembly.

FIG. 18 is a perspective view of a main frame viewed from above.

FIG. 19 is a cross-sectional view of a light reception portion substrateholding frame and a light emission portion substrate holding frame cutalong a Y-Z plane.

FIG. 20 is XX-XX cross-sectional view in FIG. 5 .

FIG. 21 is XXI-XXI cross-sectional view in FIG. 5 .

FIG. 22 is XXII-XXII cross-sectional view in FIG. 5 .

FIG. 23 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 24 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 25 is a side view of the color measurement apparatus.

FIG. 26 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 27 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 28 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 29 is a plan view of the color measurement apparatus viewed fromabove.

FIG. 30 is a perspective view of the color measurement apparatus viewedfrom below and is a diagram in which a shutter unit is at a closedposition.

FIG. 31 is a perspective view of the color measurement apparatus viewedfrom below and is a diagram in which the shutter unit is at an openposition.

FIG. 32 is a perspective view, viewed from below, of the colormeasurement apparatus from which a bottom casing is detached, and is adiagram in which the shutter unit is at the closed position.

FIG. 33 is a perspective view, viewed from below, of the colormeasurement apparatus from which the bottom casing is detached, and is adiagram in which the shutter unit is at the open position.

FIG. 34 is a diagram corresponding to a part of XXXIV-XXXIV crosssection in FIG. 6 and is a diagram in which the shutter unit is at theclosed position.

FIG. 35 is a diagram corresponding to a part of XXXV-XXXV cross sectionin FIG. 6 : an upper part of FIG. 35 is a diagram in which the shutterunit is at the closed position, and a lower part of FIG. 35 is a diagramin which the shutter unit is at the open position.

FIG. 36 is a diagram corresponding to a part of XXXVI-XXXVI crosssection in FIG. 6 and is a diagram illustrating, without the bottomcasing, a state where the shutter unit is further in a −Y direction thanthe closed position.

FIG. 37 is a diagram corresponding to a part of XXXVII-XXXVII crosssection in FIG. 6 and is a diagram illustrating, without the bottomcasing, a state where the shutter unit is at the open position.

FIG. 38 is a side view of a shutter holding member.

FIG. 39 is a partial enlarged perspective view of a shutter member.

FIG. 40 is a perspective view of the shutter holding member and a platespring.

FIG. 41 is a diagram corresponding to a part of XLI-XLI cross section inFIG. 6 and is a diagram in which the shutter unit is at the closedposition.

FIG. 42 is a diagram corresponding to a part of XLII-XLII cross sectionin FIG. 6 and is a diagram illustrating a state where the shutter unitis further in the −Y direction than the closed position.

FIG. 43 is a partial enlarged perspective view of the shutter unit.

FIG. 44 is a diagram corresponding to a part of XLIV-XLIV cross sectionin FIG. 5 and is a diagram illustrating a state where the shutter unitis at the open position.

FIG. 45 is a diagram corresponding to a part of XLV-XLV cross section inFIG. 5 and is a diagram illustrating a state where the shutter unit isat the closed position.

FIG. 46 is a diagram schematically illustrating a relationship betweenan operation region of the shutter unit and a detection region of ashutter detection portion.

FIG. 47 is a diagram illustrating another embodiment of the shutter unitand is a diagram illustrating a state where the shutter unit is at theclosed position.

FIG. 48 is a diagram illustrating another embodiment of the shutter unitand is a diagram illustrating a state where the shutter unit is at theopen position.

FIG. 49 is a diagram illustrating another embodiment of the shutter unitand is a diagram illustrating a state where the shutter unit is at theclosed position.

FIG. 50 is a diagram illustrating another embodiment of the shutter unitand is a diagram illustrating a state where the shutter unit is at theopen position.

FIG. 51 is a flowchart illustrating a processing content of a controlportion when a power OFF instruction is received.

FIG. 52 is a flowchart illustrating the processing content of thecontrol portion when acquiring a reference value.

FIG. 53 is a flowchart illustrating the processing content of thecontrol portion when performing color measurement.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, the present disclosure will be schematically described.

A color measurement apparatus according to a first aspect includes anopening portion forming member that is a member in which an openingportion for causing light arriving from a measurement target to enterinside the apparatus is formed, and that is arranged on a bottom surfaceat a time of measurement performed by the apparatus, an incident lightprocessing portion that processes light incident through the openingportion, and an operation portion that is positioned on an upper surfacewhich is a surface on an opposite side from the bottom surface, and thatreceives various operations, in which in a view from a first directionthat is a vertical direction intersecting with the bottom surface andthe upper surface which is the surface on the opposite side from thebottom surface and includes a display portion, the opening portion andthe operation portion have an overlapping part.

According to the present aspect, in the color measurement apparatus, ina view from the first direction that is the direction intersecting withthe bottom surface and the upper surface which is the surface on theopposite side from the bottom surface, the opening portion and theoperation portion have an overlapping part. Thus, when a user positionsthe opening portion to a measured part, positioning can be performedbased on a position of the operation portion. That is, the openingportion can be positioned to the measured part with a simpleconfiguration.

Particularly, in the color measurement apparatus of a handy type, whenthe operation portion is operated with a fingertip, a position of thefingertip is close to or coincides with the position of the openingportion. Thus, the position of the opening portion is intuitively easilyperceived.

A second aspect is the color measurement apparatus according to thefirst aspect, in which the operation portion includes a decision buttonthat receives at least one of decision of a measurement condition andexecution of measurement, and in a view from the first direction, acenter position of the opening portion coincides with a center positionof the decision button.

According to the present aspect, the operation portion includes thedecision button that receives at least one of decision of themeasurement condition and execution of measurement, and in a view fromthe first direction, the center position of the opening portioncoincides with the center position of the decision button. Thus, theopening portion can be more accurately positioned to the measured part.

A third aspect is the color measurement apparatus according to thesecond aspect, in which a cross button for selecting various items isarranged around the decision button, and a mark line is disposed in thecross button.

According to the present aspect, the cross button for selecting variousitems is arranged around the decision button, and the mark line isdisposed in the cross button. Thus, when the upper surface of theapparatus is viewed, the center position of the opening portion can beeasily perceived.

A fourth aspect is the color measurement apparatus according to any oneof the first to third aspects, in which the operation portion isconfigured to include a power button and all buttons related tomeasurement on the upper surface.

According to the present aspect, the operation portion is configured toinclude the power button and all buttons related to measurement on theupper surface. Thus, the power button and all buttons related tomeasurement can be easily recognized, and the apparatus can be easilyoperated.

A fifth aspect is the color measurement apparatus according to any oneof the first to fourth aspects, in which the upper surface including theoperation portion is formed into a planar shape.

According to the present aspect, the upper surface including theoperation portion is formed into the planar shape. Thus, even whenmounting is performed with the upper surface of the apparatus down,mounting can be stably performed.

A sixth aspect is the color measurement apparatus according to any oneof the first to fifth aspects, which further includes a first circuitsubstrate that includes the incident light processing portion, and thedisplay portion that is positioned on the upper surface and performsvarious kinds of display, in which in a view from the first direction,the display portion and the first circuit substrate have an overlappingpart.

A seventh aspect is the color measurement apparatus according to any oneof the first to sixth aspects, which further includes a battery thatsupplies power to the incident light processing portion, in which thebattery has a shape that extends in a second direction which is adirection intersecting with the first direction and is a longitudinaldirection of the apparatus in a view from the first direction, and bothend portions of the battery in the second direction face a side wallinner surface, in the second direction, of a casing that forms anoutline of the apparatus.

According to the present aspect, the battery has the shape that extendsin the second direction which is the direction intersecting with thefirst direction and is the longitudinal direction of the apparatus in aview from the first direction, and both end portions of the battery inthe second direction face the side wall inner surface, in the seconddirection, of the casing that forms the outline of the apparatus. Thus,excellent weight balance in the second direction is achieved, andhandleability of the apparatus is improved, compared to a configurationin which the battery is arranged in a biased manner in the seconddirection.

An eighth aspect is the color measurement apparatus according to theseventh aspect, in which the casing includes a recessed portion for gripon a side wall in a third direction that is a direction orthogonal tothe second direction and is a short direction of the apparatus in a viewfrom the first direction, and the battery and the recessed portion havean overlapping part in a view from the third direction.

According to the present aspect, the casing includes the recessedportion for grip on the side wall in the third direction that is thedirection orthogonal to the second direction and is the short directionof the apparatus in a view from the first direction, and the battery andthe recessed portion have the overlapping part in a view from the thirddirection. Thus, the battery that is a heavy object is configured to beclose to a grip position, and the handleability of the apparatus isimproved.

A ninth aspect is the color measurement apparatus according to any oneof the first to eighth aspects, in which the incident light processingportion includes a variable wavelength optical filter that transmits apredetermined wavelength component of incident light, and a lightreception portion that receives light transmitted through the opticalfilter.

According to the present aspect, an effect of any one of the first toeighth aspects is obtained in a configuration in which the incidentlight processing portion includes the variable wavelength optical filterthat transmits the predetermined wavelength component of the incidentlight, and the light reception portion that receives the lighttransmitted through the optical filter.

A tenth aspect is the color measurement apparatus according to the ninthaspect, in which the optical filter is a Fabry-Perot etalon.

According to the present aspect, an effect of the ninth aspect isobtained in a configuration in which the optical filter is theFabry-Perot etalon.

Hereinafter, the present disclosure will be specifically described.

An X-Y-Z coordinate system illustrated in each drawing is an orthogonalcoordinate system. An X-Y plane is a horizontal plane, and a Y-Z planeis a vertical plane.

In addition, a Z axis direction is a vertical direction and is oneexample of a first direction that intersects with an upper surface 50 eand a bottom surface 50 f of a color measurement apparatus 1. Inaddition, a Y axis direction is a direction orthogonal to the firstdirection, that is, the vertical direction, and is one example of asecond direction that is a longitudinal direction when the colormeasurement apparatus 1 is viewed from the vertical direction. Inaddition, an X axis direction is a direction orthogonal to the Y axisdirection and is one example of a third direction that is a shortdirection when the color measurement apparatus 1 is viewed from thevertical direction.

In description of a configuration of the color measurement apparatus 1in the present specification, the bottom surface 50 f is mounted on amounting surface parallel to the horizontal plane, and the longitudinaldirection of the color measurement apparatus 1 is in the Y axisdirection.

Overall Configuration of Color Measurement Apparatus 1

First, an overall configuration of the color measurement apparatus 1according to the present embodiment will be described with reference toFIG. 1 and FIG. 2 .

The color measurement apparatus 1 has a configuration for performingcolor measurement based on light arriving from a measurement target 200.Examples of light arriving from the measurement target 200 include lightreflected by the measurement target 200 and light emitted by themeasurement target 200 itself.

The color measurement apparatus 1 includes a bandpass filter 7, anoptical filter device 3, a light reception portion 4, an electrostaticcapacitance detection portion 6, a light emission portion 9, a microcontroller unit (MCU) 10, a wired interface (IF) 12, a wirelesscommunication portion 13, an operation portion 14, a display portion 15,a battery control portion 16, and a battery 17.

The bandpass filter 7, the optical filter device 3, and the lightreception portion 4 constitute an incident light processing portion 2that processes incident light arriving from the measurement target 200.

The bandpass filter 7 transmits light of a visible light range, forexample, 380 nm to 720 nm, and cuts light of an ultraviolet light rangeand an infrared light range out of the incident light arriving from themeasurement target 200. Accordingly, light of the visible light range isincident on the optical filter device 3. Light arriving the bandpassfilter 7 from the measurement target 200 reaches the bandpass filter 7through an opening portion 21 a and a measurement window portion 87 a(refer to FIG. 20 ) described later.

The optical filter device 3 selectively transmits any wavelengthcomponent from visible light passing through the bandpass filter 7.Light transmitted through the optical filter device 3 is incident on aphoto diode 4 a (refer to FIG. 20 ) that is one example of a lightreception element, and is processed by the light reception portion 4including the photo diode 4 a. The light reception portion 4 converts anintensity of received light into a voltage value, further converts thevoltage value into a digital signal, and outputs the digital signal tothe MCU 10. The color measurement apparatus 1 can measure a spectrum ofthe measurement target 200 by repeating wavelength selection performedby the optical filter device 3 and acquisition of a light receptionintensity using the light reception portion 4.

Here, a configuration of the optical filter device 3 will be describedwith reference to FIG. 2 . The optical filter device 3 in the presentembodiment is a variable wavelength Fabry-Perot etalon that transmits apredetermined wavelength component of the incident light arriving fromthe measurement target 200, and is a wavelength filter that usesmultiple interference between two reflection surfaces facing each other.

In FIG. 2 , the optical filter device 3 includes a variable wavelengthinterference filter 45. The variable wavelength interference filter 45is incorporated inside an exterior body that is configured with a firstglass member 30, a second glass member 31, and a case 32.

The case 32 and the first glass member 30, and the case 32 and thesecond glass member 31 are joined to each other by a joining member 33such as low melting point glass or epoxy resin. In addition, thevariable wavelength interference filter 45 and the case 32 are fixed bya fixing material 34 such as an adhesive. An electrode 36 on an outersurface of the case 32 and the variable wavelength interference filter45 are conducted by wire bonding 35 and wiring inside the case 32.

The variable wavelength interference filter 45 includes a base substrate37 and a diaphragm substrate 38. The base substrate 37 and the diaphragmsubstrate 38 are joined by a joining film 43. A mirror 39 is depositedon each of the base substrate 37 and the diaphragm substrate 38. Theoutermost surfaces of the mirrors 39 facing each other are formed of aconductor. An electrostatic capacitance between the mirrors 39 facingeach other is detected by the electrostatic capacitance detectionportion 6 (refer to FIG. 1 ). The electrostatic capacitance detectionportion 6 is configured with a capacitance to voltage (CV) converter andconverts the detected electrostatic capacitance into a voltage value,further converts the voltage value into a digital value, and transmitsthe digital value to the MCU 10.

A distance between the mirrors 39 facing each other is controlled by anelectrostatic actuator that is configured by causing a fixed electrode40 and a movable electrode 41 that are concentrically formed in a viewfrom the Z axis direction to face each other.

When a voltage is applied between the fixed electrode 40 and the movableelectrode 41 facing each other, a force that attracts the fixedelectrode 40 and the movable electrode 41 to each other is generated byan electrostatic force. At this point, a diaphragm portion 42 that isconcentrically formed is deformed. This attracts the mirror 39 of thediaphragm substrate 38 to a base substrate 37 side, and the distancebetween the mirrors 39 facing each other is controlled. A wavelength oflight transmitted through the variable wavelength interference filter 45is selected in accordance with the distance between the mirrors 39facing each other.

At a time of spectroscopic measurement, light from the measurementtarget 200 is incident on the optical filter device 3 from a secondglass member 31 side to a first glass member 30 side along an opticalaxis CL. The optical axis CL is a line that is parallel to the Z axisdirection and passes through centers of the opening portion 21 a (referto FIG. 20 ), the measurement window portion 87 a (refer to FIG. 20 ),the variable wavelength interference filter 45, and the photo diode 4 a(refer to FIG. 20 ). Particularly, the opening portion 21 a, themeasurement window portion 87 a, and the variable wavelengthinterference filter 45 (refer to FIG. 2 ) have a perfect circular shapein a view from the Z axis direction, and the optical axis CL passesthrough the centers thereof. Hereinafter, the optical axis CL may bereferred to as a center position CL.

Light incident on the optical filter device 3 interferes between themirrors 39 facing each other, and light of a wavelength selected inaccordance with the distance between the mirrors 39 facing each other istransmitted through the variable wavelength interference filter 45.Light transmitted through the variable wavelength interference filter 45is transmitted through the first glass member 30 and heads toward thelight reception portion 4.

The above is the configuration of the optical filter device 3.

Returning to FIG. 1 , the MCU 10 is a control apparatus based on amicroprocessor and incorporates a memory storing various programs andvarious data necessary for controlling the color measurement apparatus1.

The MCU 10 transmits control information necessary for driving theelectrostatic actuator, which is configured by causing the fixedelectrode 40 and the movable electrode 41 to face each other asdescribed with reference to FIG. 2 , to an amplifier, not illustrated,and supplies a predetermined drive voltage to the optical filter device3 from the amplifier. The MCU 10 compares information related to thevoltage value output from the electrostatic capacitance detectionportion 6 with a stored value and performs a feedback control of theoptical filter device 3 based on the comparison.

The light emission portion 9 emits light for measurement toward themeasurement target 200. The light emission portion 9 is configured witha plurality of light emission elements, specifically, a plurality ofLEDs, having different wavelength distributions for light emission. TheMCU 10 controls turn-on and turn-off of the light emission portion 9.

The wired IF 12 and the wireless communication portion 13 areconstituents for communicating with an external apparatus. For example,Universal Serial Bus (USB) can be employed as a standard forcommunication through the wired IF 12. In addition, for example,Bluetooth can be employed as a standard of the wireless communicationportion 13. USB and Bluetooth are registered trademarks. The MCU 10transmits various data to the external apparatus and receives variousdata from the external apparatus through the wired IF 12 or the wirelesscommunication portion 13. In addition, the color measurement apparatus 1can charge the battery 17 by receiving a supply of power from theexternal apparatus through the wired IF 12.

The operation portion 14 is configured with a power button and variousoperation setting buttons and transmits a signal corresponding to anoperation to the MCU 10. The operation portion 14 will be described infurther detail later.

The display portion 15 is configured with, for example, a liquid crystalpanel and displays various information such as a user interface forsetting a color measurement condition based on a signal transmitted fromthe MCU 10, and a color measurement result.

A magnetic sensor 128 that transmits a detection signal to the MCU 10 isa sensor for detecting a position of a shutter unit 110 described later.The magnetic sensor 128 will be described later.

The battery 17 is a lithium ion secondary battery in the presentembodiment and supplies power to each constituent needing power in thecolor measurement apparatus 1. The constituents receiving the supply ofpower from the battery 17 include an incident light processing portion 2described later. The battery control portion 16 performs variouscontrols such as a charging control of the battery 17.

Exterior Configuration of Color Measurement Apparatus 1

Next, an exterior configuration of the color measurement apparatus 1will be described with reference to FIG. 3 , FIG. 4 , FIG. 5 , and FIG.6 .

An apparatus main body 50 of the color measurement apparatus 1 isconfigured to have an outline has a box shape as a whole by a maincasing 51, an upper casing 52, and a bottom casing 53. The main casing51, the upper casing 52, and the bottom casing 53 are formed of a resinmaterial in the present embodiment.

In each drawing, reference sign 50 a denotes a side surface of theapparatus main body 50 in a +Y direction. Hereinafter, the side surfacewill be referred to as a front surface 50 a. In addition, reference sign50 b (refer to FIG. 6 ) denotes a side surface of the apparatus mainbody 50 in a +X direction. Hereinafter, the side surface will bereferred to as a right surface 50 b. In addition, reference sign 50 cdenotes a side surface of the apparatus main body 50 in a −X direction.Hereinafter, the side surface will be referred to as a left surface 50c. In addition, reference sign 50 d denotes a side surface of theapparatus main body 50 in a −Y direction. Hereinafter, the side surfacewill be referred to as a rear surface 50 d.

In the present specification, each term of “up”, “down”, “left”, and“right” is used based on a direction of view from a user when the userof the color measurement apparatus 1 uses the color measurementapparatus 1 by holding the color measurement apparatus 1 as illustratedin FIG. 27 .

In FIG. 3 to FIG. 6 , the front surface 50 a is formed by a front wallportion 51 a of the main casing 51. The right surface 50 b is formed bya right wall portion 51 b of the main casing 51. The left surface 50 cis formed by a left wall portion 51 c of the main casing 51. The rearsurface 50 d is formed by a rear wall portion 51 d of the main casing51.

In addition, reference sign 50 e denotes a surface of the apparatus mainbody 50 in a +Z direction. Hereinafter, the surface will be referred toas an upper surface 50 e. In addition, reference sign 50 f denotes asurface of the apparatus main body 50 in a −Z direction. Hereinafter,the surface will be referred to as a bottom surface 50 f.

The operation portion 14 and the display portion 15 are arranged on theupper surface 50 e of the apparatus main body 50 in the Y axisdirection.

The operation portion 14 is configured to include a power button 55, adecision button 54, a return button 56, and a cross button 60. The crossbutton 60 is configured with an up button 61, a down button 62, a leftbutton 63, and a right button 64. In the color measurement apparatus 1according to the present embodiment, all operation buttons are arrangedon the upper surface 50 e and are integrated in the operation portion14.

The power button 55 is a button for powering the color measurementapparatus 1 ON and OFF. In addition, the decision button 54 is a buttonfor deciding various settings displayed on the display portion 15, thatis, a button for deciding a color measurement condition, and is also abutton for executing color measurement. The decision button 54 has aperfect circular shape in a view from the Z axis direction.

The return button 56 is a button for returning to an immediatelyprevious state in the user interface displayed on the display portion 15and is also a button for canceling execution of an operation.

The cross button 60 is a button for selecting various items in the userinterface displayed on the display portion 15. A vertical line 58 aparallel to the Y axis direction is attached to a surface of the upbutton 61, and a vertical line 58 b parallel to the Y axis direction isattached to a surface of the down button 62. The vertical lines 58 a and58 b are at positions that pass through the center position CL when thevertical lines 58 a and 58 b are extended in the Y axis direction.

In addition, a horizontal line 58 c parallel to the X axis direction isattached to a surface of the left button 63, and a horizontal line 58 dparallel to the X axis direction is attached to a surface of the rightbutton 64. The horizontal lines 58 c and 58 d are at positions that passthrough the center position CL when the horizontal lines 58 c and 58 dare extended in the X axis direction.

Various information such as the color measurement result is displayed onthe display portion 15. The display portion 15 is configured with aliquid crystal display 67 in the present embodiment (refer to FIG. 8 aswell). Hereinafter, the liquid crystal display 67 will be abbreviated tothe LCD 67. A display portion cover 57 that is a transparent member isdisposed in an upper portion of the LCD 67, and a part of the uppersurface 50 e is formed by the display portion cover 57.

In the present embodiment, it is configured that a step almost does notoccur between an upper surface of the display portion cover 57 and anupper surface of the operation portion 14 as illustrated in FIG. 20 .Accordingly, the upper surface 50 e is configured as a planar surfacethat almost does not have a step as a whole. However, an upper surfaceof the decision button 54 is slightly recessed as illustrated in FIG. 20and is formed into a shape that fits a pulp of a finger of the userpushing the decision button 54 as illustrated in FIG. 27 .

The shutter unit 110 is disposed on the bottom surface 50 f asillustrated in FIG. 4 and FIG. 6 . FIG. 4 illustrates a state where theshutter unit 110 is at a closed position, and FIG. 6 illustrates a statewhere the shutter unit 110 is at an open position. The shutter unit 110can be displaced between the closed position and the open position bysliding the shutter unit 110 in the Y axis direction. In addition, theshutter unit 110 is disposed to be holdable at the closed position andthe open position.

The shutter unit 110, as will be described in detail later, isconfigured to include a shutter holding member 111 and a link member113. The shutter holding member 111 includes a plurality of ribs 111 aon a surface thereof. The user can slide the shutter unit 110 in the Yaxis direction by hooking the pulp of the finger to the ribs 111 a.

Opening the shutter unit 110 exposes the opening portion 21 a and themeasurement window portion 87 a as illustrated in FIG. 6 . The openingportion 21 a and the measurement window portion 87 a are open on thebottom surface 50 f of the apparatus. Here, being open means that lightenters, and for example, means that a transparent glass plate may bedisposed.

As illustrated in FIG. 20 , the opening portion 21 a is formed in anopening portion forming member 21, and the measurement window portion 87a is formed in a light condensing member 87 that is positioned in the +Zdirection with respect to the opening portion forming member 21.Measurement light emitted from the light emission portion 9 passesbetween the light condensing member 87 and the opening portion formingmember 21 as illustrated by an arrow inside the opening portion 21 a inFIG. 20 , and is emitted toward the measurement target 200 from theopening portion 21 a. Light arriving from the measurement target 200enters inside the apparatus from the opening portion 21 a, furtherpasses through the measurement window portion 87 a, and is incident onthe incident light processing portion 2.

As illustrated in FIG. 5 and FIG. 6 , the center position CL coincideswith center positions of the opening portion 21 a and the measurementwindow portion 87 a. In addition, a straight line VCL is a straight lineparallel to the Y axis direction and is a straight line passing throughthe center position CL in a view from the Z axis direction. In addition,a straight line HCL is a straight line parallel to the Y axis directionand is a straight line passing through the center position CL in a viewfrom the Z axis direction.

In the present embodiment, the center position CL coincides with acenter position of the decision button 54 in the X-Y plane and alsocoincides with a center position of the cross button 60.

The power button 55 and the return button 56 are symmetrically arrangedabout the straight line VCL as illustrated in FIG. 5 .

Next, as illustrated in FIG. 3 , the wired IF 12 is disposed on thefront surface 50 a of the apparatus main body 50. In addition, asillustrated in FIG. 4 , an opening 50 m is formed on the rear surface 50d of the apparatus main body 50, and a reset switch 71 (refer to FIG. 9and FIG. 20 ) is disposed behind the opening 50 m. The reset switch 71is a switch for returning various settings of the color measurementapparatus 1 to an initial state.

In addition, two openings 50 n are formed at positions in the −Zdirection with respect to the opening 50 m, and it is configured thatthe user can easily carry the color measurement apparatus 1 by passing astrap (not illustrated) through the two openings 50 n.

As illustrated in FIG. 3 , FIG. 4 , FIG. 21 , and FIG. 22 , a gripportion 50 g is formed on the right surface 50 b and the left surface 50c of the apparatus main body 50. The grip portion 50 g is configuredwith a recessed portion 51 g formed in each of the right wall portion 51b and the left wall portion 51 c of the main casing 51. The recessedportion 51 g is formed by a curved surface that faces toward a center,in the X axis direction, of the apparatus main body 50 in the −Zdirection.

By disposing the grip portion 50 g, the user can easily and securelygrip the apparatus main body 50.

Substrate Configuration of Color Measurement Apparatus 1

Next, a substrate configuration of the color measurement apparatus 1will be described.

A main body assembly 1 a illustrated in FIG. 7 is an assembly bodydisposed inside the main casing 51 and is configured by assembling aplurality of circuit substrates and the like in a frame assembly 100that is an assembly of a plurality of frames.

As illustrated in FIG. 7 , FIG. 8 , and FIG. 9 , the plurality ofcircuit substrates are configured with a panel substrate 65 as a “secondcircuit substrate”, a battery control substrate 70 as a “third circuitsubstrate”, a light reception portion substrate 80 as a “first circuitsubstrate”, and a light emission portion substrate 85 as a “fourthcircuit substrate”. The plurality of circuit substrates are disposed tooverlap at intervals in the Z axis direction. The battery 17 is arrangedbetween the panel substrate 65 and the battery control substrate 70 inthe Z axis direction.

Hereinafter, a configuration of each circuit substrate will be describedwith reference to FIG. 10 to FIG. 13 and other appropriate drawings aswell. Hereinafter, a surface of each circuit substrate in the +Zdirection may be referred to as an “upper surface”, and a surface ofeach circuit substrate in the −Z direction may be referred to as a“lower surface”. In addition, in FIG. 10 to FIG. 13 , a part ofelectronic components disposed on the substrate is not illustrated.

The panel substrate 65 includes a LCD coupling portion 66 on the uppersurface thereof as illustrated in the upper part of FIG. 10 . The LCD 67is coupled to the LCD coupling portion 66 by a cable 67 a as illustratedin FIG. 20 .

In the upper part of FIG. 10 , a contact for detecting a push of eachoperation button is disposed on the upper surface of the panel substrate65 at a position corresponding to each operation button constituting theoperation portion 14. Reference sign 54 a denotes a contact disposed ata position corresponding to the decision button 54. Reference sign 54 adenotes a contact disposed at a position corresponding to the decisionbutton 54. Reference signs 61 a, 62 a, 63 a, and 64 a are contactsdisposed at positions corresponding to the up button 61, the down button62, the left button 63, the right button 64 (refer to FIG. 1 and thelike), respectively. In addition, reference signs 55 a and 56 a arecontacts disposed at positions corresponding to the power button 55 andthe return button 56, respectively.

As illustrated in the lower part of FIG. 10 , a first substrate couplingconnector 68 is disposed on the lower surface of the panel substrate 65.The panel substrate 65 and the light reception portion substrate 80described later are coupled by coupling the first substrate couplingconnector 68 to a fourth substrate coupling connector 83 illustrated inthe lower part of FIG. 12 by a flexible flat cable (FFC) 90 asillustrated in FIG. 9 .

In addition, as illustrated in the lower part of FIG. 10 , the wirelesscommunication portion 13 that is a communication module is disposed onthe lower surface of the panel substrate 65.

Next, the battery control substrate 70 will be described with referenceto FIG. 11 . The battery control substrate 70 implements a function ofthe battery control portion 16 (refer to FIG. 1 ). As illustrated in theupper part of FIG. 11 , the battery control substrate 70 includes thereset switch 71, the wired IF 12, a first battery connector 72, and asecond battery connector 73 on the upper surface thereof. A batterycontrol circuit not illustrated in FIG. 11 is disposed on the uppersurface of the battery control substrate 70.

The first battery connector 72 is coupled to the battery 17 by a firstbattery cable 92 as illustrated in FIG. 8 , and the second batteryconnector 73 is coupled to the battery 17 by a second battery cable 93as illustrated in FIG. 8 .

As illustrated in the lower part of FIG. 11 , the battery controlsubstrate 70 includes a second substrate coupling connector 74. Thebattery control substrate 70 and the light reception portion substrate80 are coupled by engaging the second substrate coupling connector 74with a third substrate coupling connector 82 illustrated in the upperpart of FIG. 12 . Accordingly, power of the battery 17 is supplied toeach circuit substrate through the light reception portion substrate 80.

Next, the light reception portion substrate 80 will be described withreference to FIG. 12 . The light reception portion substrate 80 includesa photo diode (PD) substrate 5 on the upper surface thereof and alsoincludes the third substrate coupling connector 82. As illustrated inFIG. 20 , the PD substrate 5 includes the photo diode 4 a on the lowersurface thereof. The PD substrate 5 is a circuit substrate constitutingthe light reception portion 4 (refer to FIG. 1 ). That is, the PDsubstrate 5 constitutes the incident light processing portion 2 (referto FIG. 1 ) that processes incident light.

The light reception portion substrate 80 includes the optical filterdevice 3, the fourth substrate coupling connector 83, and a fifthsubstrate coupling connector 84 on the lower surface thereof. The lightreception portion substrate 80 and the light emission portion substrate85 described later are coupled by coupling the fifth substrate couplingconnector 84 to a sixth substrate coupling connector 88 illustrated inthe lower part of FIG. 13 by a coupling cable 91 as illustrated in FIG.9 .

Electronic components not illustrated in FIG. 11 are disposed in thelight reception portion substrate 80. The electronic components notillustrated in FIG. 11 include the MCU 10 (refer to FIG. 1 ), a CVconverter constituting the electrostatic capacitance detection portion 6(refer to FIG. 1 ), a DC/DC converter that converts a voltage of thebattery 17, an amplifier that adjusts an output from the DC/DC converterunder control of the MCU 10 and supplies the adjusted output to theoptical filter device 3, a temperature sensor for detecting atemperature around the optical filter device 3, and the like.

As illustrated in FIG. 11 , a shielding sheet 29 is disposed to surroundthe PD substrate 5 and the optical filter device 3 disposed in the lightreception portion substrate 80 (refer to FIG. 7 as well). Accordingly,entrance of extraneous light into the PD substrate 5 and the opticalfilter device 3 is suppressed.

Next, the light emission portion substrate 85 will be described withreference to FIG. 13 . The light emission portion substrate 85 includesthe light condensing member 87 throughout between the upper surface andthe lower surface thereof. The measurement window portion 87 a is formedin the light condensing member 87.

As illustrated in the lower part of FIG. 13 , the sixth substratecoupling connector 88 is disposed on the lower surface of the lightemission portion substrate 85, and a plurality of light emissionelements 86 are disposed around the light condensing member 87. Theplurality of light emission elements 86 are configured with lightemission elements having different wavelength distributions for lightemission.

A light shielding member 89 is disposed around the light emissionelements 86, and leakage of the measurement light emitted from the lightemission elements 86 is suppressed by the light shielding member 89.

Configuration of Frame Assembly

Next, the frame assembly 100 constituting a base of the apparatus mainbody 50 will be described.

In FIG. 14 to FIG. 17 , the frame assembly 100 is configured to includea main frame 101, a battery holding frame 102, a light reception portionsubstrate holding frame 103, and a bottom frame 105. In the presentembodiment, all frames are formed by folding a metal material. Morespecifically, aluminum is used as the material. Instead of folding themetal material, each frame can be created by die casting or the like.

Hereinafter, each frame will be described in order. The main frame 101is a frame forming the base of the apparatus main body 50 and includes amain plate portion 101 a that forms a frame surface extending in the Yaxis direction and the Z axis direction, in other words, a frame surfacethat is wide in the Y-Z plane, as illustrated in FIG. 18 . In addition,the main frame 101 includes a panel substrate support portion 101 b thatforms a frame surface which extends in the −X direction from a +Zdirection end portion of the main plate portion 101 a and is parallel tothe X-Y plane.

As illustrated in FIG. 7 and FIG. 20 , the panel substrate supportportion 101 b supports the panel substrate 65 from below. The panelsubstrate 65 is fixed with respect to the panel substrate supportportion 101 b by a screw not illustrated. The panel substrate 65 is insurface contact with the panel substrate support portion 101 b.Accordingly, heat of the panel substrate 65 is transferred to the panelsubstrate support portion 101 b, that is, the main frame 101.

As illustrated in FIG. 18 , in a −Z direction end portion of the mainplate portion 101 a, a battery control substrate support portion 101 ethat is parallel to the X-Y plane and has a +Y direction end portionfolded in the −X direction and furthermore, a +Z direction end portionfolded in the −Y direction is formed. Similarly, in the −Z direction endportion of the main plate portion 101 a, the battery control substratesupport portion 101 e that is parallel to the X-Y plane and has a −Ydirection end portion folded in the −X direction and furthermore, a +Zdirection end portion folded in the +Y direction is formed.

As illustrated in FIG. 7 and FIG. 20 , the battery control substratesupport portion 101 e supports the battery control substrate 70 frombelow. The battery control substrate 70 is fixed with respect to thebattery control substrate support portion 101 e by a screw notillustrated. The battery control substrate 70 is in surface contact withthe battery control substrate support portion 101 e. Accordingly, heatof the battery control substrate 70 is transferred to the batterycontrol substrate support portion 101 e, that is, the main frame 101.

In FIG. 14 to FIG. 18 , a frame holding portion 101 f is formed inparallel with the X-Y plane below the battery control substrate supportportion 101 e. As illustrated in FIG. 14 and FIG. 16 , the frame holdingportion 101 f holds a light emission portion substrate holding frame104. The light emission portion substrate holding frame 104 is fixed toa lower side of the frame holding portion 101 f by a screw notillustrated. The light emission portion substrate holding frame 104 isin surface contact with the frame holding portion 101 f. That is, thelight emission portion substrate holding frame 104 is in direct contactwith the main frame 101. Accordingly, heat of the light emission portionsubstrate holding frame 104 is transferred to the frame holding portion101 f, that is, the main frame 101.

As illustrated in FIG. 7 and FIG. 20 , the light emission portionsubstrate holding frame 104 holds the light emission portion substrate85. The light emission portion substrate holding frame 104 is oneexample of a second subframe that holds the light emission portionsubstrate 85. The light emission portion substrate 85 is fixed to alower side of the light emission portion substrate holding frame 104 bya screw not illustrated. The light emission portion substrate 85 is insurface contact with the light emission portion substrate holding frame104. Accordingly, heat of the light emission portion substrate 85 istransferred to the light emission portion substrate holding frame 104and further to the main frame 101.

As illustrated in FIG. 15 , the bottom frame 105 is fixed to a lowersurface of the light emission portion substrate holding frame 104 by ascrew not illustrated. As will be described in detail later, the bottomframe 105 is a frame for fixing one end of a torsion spring 117 (referto FIG. 32 ) that presses the shutter unit 110 (refer to FIG. 32 ).

The bottom frame 105 includes a first plate portion 105 a and a secondplate portion 105 b, and the second plate portion 105 b is in surfacecontact with the light emission portion substrate holding frame 104.Accordingly, heat of the light emission portion substrate holding frame104 is transferred to the bottom frame 105. That is, the bottom frame105 functions as a heat sink that promotes heat dissipation of the lightemission portion substrate holding frame 104.

In FIG. 14 to FIG. 18 , the main frame 101 has a subplate portion 101 cthat forms a frame surface which extends in the −Z direction from a −Xdirection end portion of the panel substrate support portion 101 b andis parallel to the Y-Z plane. Here, the battery holding frame 102 isattached to the main frame 101. In a state where the battery holdingframe 102 is attached, the subplate portion 101 c and the panelsubstrate support portion 101 b, together with the battery holding frame102, constitute a battery holding portion 100 a that holds the battery17.

Hereinafter, the battery holding portion 100 a will be furtherdescribed. The battery holding frame 102 includes a battery supportportion 102 a that forms a frame surface parallel to the X-Y plane. Asillustrated in FIG. 20 , the battery support portion 102 a supports thebattery 17 from below. A bottom surface of the battery 17 is in surfacecontact with the battery support portion 102 a. Accordingly, heat of thebattery 17 is transferred to the battery support portion 102 a, that is,the battery holding portion 100 a.

In FIG. 14 to FIG. 17 , a first frame portion 102 b that forms a framesurface parallel to the Y-Z plane stands in the +Z direction from a −Xdirection end portion of the battery support portion 102 a. In addition,a second frame portion 102 c that forms a frame surface parallel to theY-Z plane stands in the +Z direction from a +X direction end portion ofthe battery support portion 102 a.

The first frame portion 102 b is positioned in the −X direction withrespect to the subplate portion 101 c of the main frame 101 and is insurface contact with the subplate portion 101 c. In addition, the secondframe portion 102 c is positioned in the −X direction with respect tothe main plate portion 101 a of the main frame 101 and is in surfacecontact with the main plate portion 101 a.

In such a manner, the battery holding portion 100 a is configured tosurround the battery 17 by the battery holding frame 102, the panelsubstrate support portion 101 b, and the subplate portion 101 c.

The battery support portion 102 a is one example of a first wall portionthat supports the battery 17 from below, and constitutes the batteryholding portion 100 a. In addition, the panel substrate support portion101 b is one example of a second wall portion that faces the batterysupport portion 102 a, and constitutes the battery holding portion 100a. In addition, the subplate portion 101 c is one example of a thirdwall portion that is positioned in the −X direction with respect to thebattery 17, and constitutes the battery holding portion 100 a. Inaddition, the second frame portion 102 c is one example of a fourth wallportion that is positioned in the +X direction with respect to thebattery 17, and constitutes the battery holding portion 100 a.

As illustrated in FIG. 7 , FIG. 14 , and FIG. 20 , a regulation portion101 d is formed to extend in the −Z direction from a +Y direction endportion of the panel substrate support portion 101 b. As illustrated inFIG. 7 and FIG. 20 , the regulation portion 101 d regulates movement ofthe battery 17 in the +Y direction.

As illustrated in FIG. 20 as well, an elastic material 28 is disposedbetween the regulation portion 101 d and a first end portion 17 a thatis a +Y direction end portion of the battery 17. As illustrated in FIG.20 , the elastic material 28 is also disposed between an upper surfaceof the battery 17 and the panel substrate support portion 101 b.

Next, as illustrated in FIG. 14 and FIG. 16 , the light receptionportion substrate holding frame 103 includes a base portion 103 b thatforms a frame surface parallel to the X-Y plane, and a light receptionportion substrate support portion 103 a. The light reception portionsubstrate support portion 103 a is positioned further in the +Zdirection than the base portion 103 b. As illustrated in FIG. 7 and FIG.20 , the light reception portion substrate support portion 103 asupports the light reception portion substrate 80 from below. The lightreception portion substrate 80 is fixed to the light reception portionsubstrate support portion 103 a by a screw not illustrated. The lightreception portion substrate holding frame 103 is one example of a firstsubframe that holds the light reception portion substrate 80.

The light reception portion substrate 80 is in surface contact with thelight reception portion substrate support portion 103 a. Accordingly,heat of the light reception portion substrate 80 is transferred to thelight reception portion substrate holding frame 103.

As illustrated in FIG. 19 , the light reception portion substrateholding frame 103 is supported from below by the light emission portionsubstrate holding frame 104.

Reference signs 104 a and 104 b denote a frame support portion that is apart supporting the light reception portion substrate holding frame 103.The frame support portions 104 a and 104 b form frame surfaces parallelto the X-Y plane and are in surface contact with a bottom surface of thelight reception portion substrate holding frame 103. Accordingly, heatof the light reception portion substrate holding frame 103 istransferred to the light emission portion substrate holding frame 104.Since the light emission portion substrate holding frame 104 is incontact with the main frame 101, heat of the light reception portionsubstrate holding frame 103 is transferred to the main frame 101 throughthe light emission portion substrate holding frame 104. That is, thelight reception portion substrate holding frame 103 is said to be inindirect contact with the main frame 101.

Other Configurations of Color Measurement Apparatus

Hereinafter, other configurations of the color measurement apparatus 1excluding the shutter unit 110 will be described.

In FIG. 23 , a contour of the battery 17 in a view from the Z axisdirection is illustrated by a chain double dash line. In addition, theoptical filter device 3, the PD substrate 5, the wireless communicationportion 13, the battery control substrate 70, and the light receptionportion substrate 80 are illustrated by a broken line. In the presentembodiment, in a view from the Z axis direction, a contour of thebattery control substrate 70 coincides with a contour of the lightreception portion substrate 80 excluding a −Y direction end portion. Inthe −Y direction end portion, the contour of the light reception portionsubstrate 80 is positioned slightly further in the +Y direction than thecontour of the battery control substrate 70.

Here, as described above, the optical filter device 3 and the PDsubstrate 5 constitute the incident light processing portion 2 thatprocesses the incident light. As illustrated in FIG. 23 , the incidentlight processing portion 2 and the battery 17 have an overlapping partin a view from the Z axis direction.

More specifically, in the present embodiment, the incident lightprocessing portion 2 falls within a region of the battery 17 in a viewfrom the Z axis direction. While illustration is not provided in FIG. 23, as is apparent from FIG. 20 and FIG. 21 , the bandpass filter 7 (referto FIG. 20 and FIG. 21 ) constituting the incident light processingportion 2 falls within a region of the PD substrate 5 in a view from theZ axis direction.

In such a manner, since the incident light processing portion 2 and thebattery 17 have an overlapping part in a view from the Z axis direction,an apparatus dimension in the X axis direction and the Y axis directionthat are directions intersecting with the Z axis direction, that is, theapparatus dimension in the horizontal direction, can be suppressed,compared to a configuration in which the incident light processingportion 2 and the battery 17 are arranged in a direction intersectingwith the Z axis direction, that is, the horizontal direction.

In addition, in the present embodiment, since the incident lightprocessing portion 2, that is, the optical filter device 3 and the PDsubstrate 5, falls within the region of the battery 17 in a view fromthe Z axis direction, the apparatus dimension in the horizontaldirection can be further suppressed.

In addition, FIG. 24 illustrates a contour of the battery holdingportion 100 a (refer to FIG. 7 and FIG. 14 ) that holds the battery 17,instead of the contour of the battery 17 illustrated in FIG. 23 . Thatis, even from a viewpoint of the battery holding portion 100 a, theincident light processing portion 2 and the battery holding portion 100a also have an overlapping part in a view from the Z axis direction.Thus, the apparatus dimension in the horizontal direction can besuppressed, compared to a configuration in which the incident lightprocessing portion 2 and the battery holding portion 100 a are arrangedin a direction intersecting with the Z axis direction, that is, thehorizontal direction.

In the present embodiment, while the optical filter device 3 and the PDsubstrate 5, that is, the incident light processing portion 2, fallwithin the region of the battery 17 or the battery holding portion 100 ain a view from the Z axis direction, a part of the incident lightprocessing portion 2 may be out of the region of the battery 17 or thebattery holding portion 100 a.

In addition, as illustrated in FIG. 23 , in the present embodiment, thebattery 17 falls within a region of the light reception portionsubstrate 80 in the X axis direction, in a view from the Z axisdirection. In addition, a +Y direction end portion of the battery 17 isinward of a +Y direction end portion of the light reception portionsubstrate 80, and a −Y direction end portion of the battery 17 extendsslightly further than a −Y direction end portion of the light receptionportion substrate 80. However, the battery 17 may be configured tocompletely fall within the region of the light reception portionsubstrate 80 in a view from the Z axis direction. With such aconfiguration, the apparatus dimension in the horizontal direction canbe further suppressed.

In addition, in the present embodiment, as illustrated in FIG. 23 , thedisplay portion 15 and the light reception portion substrate 80 have anoverlapping part in a view from the Z axis direction.

In addition, the color measurement apparatus 1 includes the lightreception portion substrate 80 including the incident light processingportion 2, the panel substrate 65 to which the LCD 67 is coupled, thebattery control substrate 70 to which the battery 17 is coupled, and thelight emission portion substrate 85 including the light emission portion9 that emits the light for measurement.

In order from the bottom surface 50 f to the upper surface 50 e of theapparatus main body 50 in the Z axis direction, the light emissionportion substrate 85, the light reception portion substrate 80, and thepanel substrate 65 are arranged in an overlapping manner as illustratedin FIG. 8 .

In addition, in order from the bottom surface 50 f to the upper surface50 e of the apparatus main body 50 in the Z axis direction, the batterycontrol substrate 70, the battery 17, and the panel substrate 65 arearranged in an overlapping manner.

In the present embodiment, in order from the bottom surface 50 f to theupper surface 50 e of the apparatus main body 50 in the Z axisdirection, the light emission portion substrate 85, the light receptionportion substrate 80, the battery control substrate 70, the battery 17,and the panel substrate 65 are arranged in an overlapping manner.

With such a configuration, the apparatus dimension in the X axisdirection and the Y axis direction, that is, the horizontal direction,that are directions intersecting with the Z axis direction can besuppressed.

Electronic components mounted on the battery control substrate 70 may beappropriately arranged in the panel substrate 65 or the light receptionportion substrate 80 without disposing the battery control substrate 70.

In addition, configurations disposed in an overlapping manner in the Zaxis direction may be a combination of any two, or three or more of thelight emission portion substrate 85, the light reception portionsubstrate 80, the battery control substrate 70, the battery 17, and thepanel substrate 65.

In addition, the battery 17 has a shape that extends in the Y axisdirection, which is the longitudinal direction of the apparatus, and thefirst end portion 17 a that is the +Y direction end portion of thebattery 17 faces a front inner wall surface 51 e of the main casing 51as illustrated in FIG. 20 . In addition, a second end portion 17 b thatis the −Y direction end portion of the battery 17 faces a rear innerwall surface 51 f of the main casing 51. That is, both end portions ofthe battery 17 in the Y axis direction face side wall inner surfaces ofthe main casing 51 in the Y axis direction.

Accordingly, compared to a configuration in which the battery 17 isarranged in a biased manner in the Y axis direction, excellent weightbalance of the apparatus main body 50 in the Y axis direction isachieved, and handleability of the apparatus is improved.

In the present embodiment, as illustrated in FIG. 21 and FIG. 22 , thebattery 17 is at a center position of the apparatus even in the X axisdirection. Thus, excellent weight balance of the apparatus main body 50in the X axis direction is also achieved.

In addition, as described with reference to FIG. 3 , FIG. 4 , FIG. 21 ,and FIG. 22 , the recessed portion 51 g constituting the grip portion 50g is formed in the main casing 51 on the right surface 50 b and the leftsurface 50 c of the apparatus main body 50, and it is configured thatthe user can easily and securely grip the apparatus main body 50. Here,a range illustrated by arrow Za in FIG. 22 and FIG. 25 is a range inwhich the recessed portion 51 g is formed in the Z axis direction. Asillustrated in FIG. 25 , the recessed portion 51 g and the battery 17have an overlapping part in a view from the X axis direction.

Accordingly, the battery 17 that is a heavy object is configured to beclose to a grip position, and the handleability of the apparatus isimproved.

In addition, as illustrated in FIG. 22 , in the right wall portion 51 band the left wall portion 51 c of the main casing 51, parts on a bottomsurface 50 f side, that is, in the −Z direction, from the recessedportion 51 g are at the same position as a part of the LCD 67 in the Xaxis direction. The parts of the right wall portion 51 b and the leftwall portion 51 c in the −Z direction from the recessed portion 51 g areparts in the −Z direction from a position denoted by reference sign Z4.Accordingly, as illustrated in FIG. 26 , the parts of the right wallportion 51 b and the left wall portion 51 c in the −Z direction from therecessed portion 51 g have an overlapping part with the LCD 67 in a viewfrom the Z axis direction. Accordingly, as illustrated in FIG. 22 , sizereduction, in the X axis direction, of an apparatus part in the −Zdirection from the recessed portion 51 g can be achieved.

In addition, as illustrated in FIG. 23 , the color measurement apparatus1 has an overlapping part with the opening portion 21 a and theoperation portion 14 in a view from the Z axis direction. Accordingly,when the user positions the opening portion 21 a to a measured part ofthe measurement target 200 (refer to FIG. 1 ), the positioning can beperformed based on a position of the operation portion 14. That is, theopening portion 21 a can be positioned to the measured part using asimple configuration.

Particularly, the color measurement apparatus 1 is configured as a handytype, and a position of a fingertip Fa and a position of the openingportion 21 a come closer when the user operates the operation portion 14with the fingertip Fa as illustrated in FIG. 27 . Thus, the position ofthe opening portion 21 a is intuitively easily perceived.

In addition, particularly, in the present embodiment, a center positionof the opening portion 21 a coincides with the center position of thedecision button 54 in a view from the Z axis direction.

Accordingly, the opening portion 21 a can be more accurately positionedto the measured part.

In addition, as illustrated in FIG. 5 , the decision button 54 has acircular shape in a view from the Z axis direction, and the cross button60 for selecting various items is arranged around the decision button54. In the cross button 60, a mark line is disposed to radiate outwardfrom the center position of the decision button 54. The mark line isconfigured with the vertical lines 58 a and 58 b and the horizontallines 58 c and 58 d.

Accordingly, when the upper surface 50 e of the apparatus is viewed, thecenter position of the opening portion 21 a is easily perceived.

In addition, the operation portion 14 is configured by including thepower button 55 and all buttons related to measurement on the uppersurface 50 e. Accordingly, the power button 55 and all buttons relatedto measurement can be easily recognized, and the apparatus can be easilyoperated.

In addition, the upper surface 50 e including the operation portion 14is formed into a planar shape. Accordingly, even in a case of mountingwith the upper surface 50 e down, mounting can be stably performed.

In addition, as illustrated in FIG. 28 , the panel substrate 65 and thebattery 17 have an overlapping part in a view from the Z axis direction.FIG. 28 illustrates a contour of the panel substrate 65 instead of thecontours of the battery control substrate 70 and the light receptionportion substrate 80 illustrated in FIG. 23 . By causing the panelsubstrate 65 and the battery 17 to have an overlapping part in a viewfrom the Z axis direction, the apparatus dimension in the horizontaldirection can be suppressed, compared to a configuration in which thepanel substrate 65 and the battery 17 are arranged in the X axisdirection or the Y axis direction, that is, the horizontal direction.

The battery 17 may be configured to fall within a region of the panelsubstrate 65 in a view from the Z axis direction. With such aconfiguration, the apparatus dimension in the horizontal direction canbe further suppressed.

In addition, in the present embodiment, the wireless communicationportion 13 falls within the region of the battery 17 in a view from theZ axis direction. However, a part of the wireless communication portion13 may be within the region of the battery 17, or the entire wirelesscommunication portion 13 may be outside the region of the battery 17.

In addition, FIG. 29 illustrates the contour of the battery holdingportion 100 a (refer to FIG. 7 and FIG. 14 ) that holds the battery 17,instead of the contour of the battery 17 illustrated in FIG. 28 . Thatis, even from the viewpoint of the battery holding portion 100 a, thepanel substrate 65 and the battery holding portion 100 a also have anoverlapping part in a view from the Z axis direction. Thus, theapparatus dimension in the horizontal direction can be suppressed,compared to a configuration in which the panel substrate 65 and thebattery holding portion 100 a are arranged in a direction intersectingwith the Z axis direction, that is, the horizontal direction.

In addition, as illustrated in FIG. 7 , the wireless communicationportion 13 is disposed on the lower surface of the panel substrate 65,and the wireless communication portion 13 is arranged inside the batteryholding portion 100 a in a state where the panel substrate 65 issupported by the panel substrate support portion 101 b. In such amanner, by arranging the wireless communication portion 13 using theinside of the battery holding portion 100 a, size reduction of theapparatus can be achieved.

Here, there is a concern that heat dissipation from the battery holdingportion 100 a exerts an adverse effect on the wireless communicationportion 13. However, a notch portion 100 b is formed in the batteryholding portion 100 a (refer to FIG. 14 as well), and the wirelesscommunication portion 13 is arranged at a position facing the notchportion 100 b. That is, when the battery holding portion 100 a is viewedfrom the −X direction, the wireless communication portion 13 is exposedthrough the notch portion 100 b. Accordingly, exerting an adverse effecton the wireless communication portion 13 by heat dissipation from thebattery holding portion 100 a can be suppressed.

Next, in the present embodiment, as illustrated in FIG. 20 , the battery17 is disposed between the operation portion 14 and the incident lightprocessing portion 2 in the Z axis direction. As described above, in thepresent embodiment, the incident light processing portion 2 includes theoptical filter device 3 and the PD substrate 5. In FIG. 20 , a positiondenoted by reference sign Z1 is a position furthest in the +Z directionin the PD substrate 5 that is positioned furthest in the +Z direction inthe incident light processing portion 2. In addition, a position denotedby reference sign Z3 is a position furthest in the −Z direction in apart constituting the operation portion 14 and specifically, is a Zdirection position of each contact (in FIG. 20 , reference signs 54 a,61 a, and 62 a). A position denoted by reference sign Z2 is a middleposition between the position Z1 and the position Z3.

Here, the battery 17 includes a thermistor 18 inside the battery 17. Thethermistor 18 is one example of a temperature detection portion. When aninternal temperature of the battery 17 acquired by the thermistor 18exceeds a predetermined allowed temperature, the MCU 10 (refer to FIG. 1) cuts the supply of power to each constituent from the battery 17.

The thermistor 18 is positioned further in the +Z direction than theposition Z2 in the Z axis direction, that is, arranged at a positioncloser to the operation portion 14 than the incident light processingportion 2.

Here, in the present embodiment, the incident light processing portion 2is a part in which a part of the supplied power is converted into heatamong the constituents of the color measurement apparatus 1, and is apart in which heat emission exerts an adverse effect on temperaturedetection performed by the thermistor 18. In the incident lightprocessing portion 2, heat emission in the PD substrate 5 isparticularly noticeable. However, since the thermistor 18 is arranged ata position closer to the operation portion 14 than the incident lightprocessing portion 2, an adverse effect exerted on the thermistor 18 byheat generated in the incident light processing portion 2 can besuppressed, and a temperature of the battery 17 can be moreappropriately detected.

In addition, as described above, the frame assembly 100 includes thebattery holding portion 100 a that has a shape surrounding the battery17 (refer to FIG. 7 ). Thus, heat generated from the battery 17favorably dissipates by the battery holding portion 100 a.

In addition, the thermistor 18 and the incident light processing portion2 are disposed in one side end portion of the main body assembly 1 a(refer to FIG. 7 ) in the Y axis direction, that is, a position biasedto a +Y direction end portion. The position biased to the +Y directionend portion means a position that is further in the +Y direction than amiddle position of the main body assembly 1 a in the Y axis direction.The wired IF 12 that is a coupling portion for performing wiredcommunication with the external apparatus is included in one side endportion of the main body assembly 1 a in the Y axis direction, that is,a position biased to the +Y direction end portion. The wired IF 12 ispositioned between the thermistor 18 and the incident light processingportion 2 in the Z axis direction.

Here, since the wired IF 12 is disposed inside the opening portion(refer to FIG. 3 ), heat dissipation from the inside of the apparatus toan outside is promoted around the wired IF 12. As illustrated in FIG. 20, the wired IF 12 is positioned between the thermistor 18 and theincident light processing portion 2 in the Z axis direction. Thus, heatgenerated in the incident light processing portion 2 dissipates to theoutside of the apparatus from the wired IF 12 before reaching thethermistor 18. Accordingly, an adverse effect exerted on the thermistor18 by heat generated in the incident light processing portion 2 can besuppressed.

In addition, as illustrated in FIG. 20 , the display portion 15 and theoperation portion 14 are arranged in the Y axis direction, and thethermistor 18 is arranged within a region of the operation portion 14 inthe Y axis direction. That is, while heat emission is more likely to benoticeable in the LCD 67 constituting the display portion 15 than in theoperation portion 14, the thermistor 18 is arranged within the region ofthe operation portion 14 in the Y axis direction in a configuration inwhich the display portion 15 and the operation portion 14 are arrangedin the Y axis direction as described above. Thus, an adverse effectexerted on the thermistor 18 by heat generated in the LCD 67 can besuppressed.

In addition, as illustrated in FIG. 7 , FIG. 14 , and FIG. 15 , thecolor measurement apparatus 1 includes the light reception portionsubstrate 80 and the light emission portion substrate 85 and includesthe frame assembly 100 that is formed of a metal material. The frameassembly 100 includes the main frame 101 that forms the base of theapparatus, the light reception portion substrate holding frame 103 thatholds the light reception portion substrate 80, and the light emissionportion substrate holding frame 104 that holds the light emissionportion substrate 85. The light reception portion substrate holdingframe 103 and the light emission portion substrate holding frame 104 arein direct or indirect contact with the main frame 101.

More specifically, in the present embodiment, as described above, eachframe constituting the frame assembly 100 is formed of aluminum. Asdescribed above, the light emission portion substrate holding frame 104is in direct contact with the main frame 101, and the light receptionportion substrate holding frame 103 is in indirect contact with the mainframe 101 through the light emission portion substrate holding frame104.

With such a configuration, heat generated in the light reception portionsubstrate 80 and the light emission portion substrate 85 is transferredto the entire frame assembly 100. A local increase in temperature insidethe apparatus can be suppressed, and exerting an adverse effect on thecolor measurement result and the like can be suppressed.

In the present embodiment, while the light reception portion substrateholding frame 103 is in indirect contact with the main frame 101, thelight reception portion substrate holding frame 103 may be in directcontact with the main frame 101. In addition, in the present embodiment,while the light emission portion substrate holding frame 104 is indirect contact with the main frame 101, the light emission portionsubstrate holding frame 104 may be in indirect contact with the mainframe 101.

When the light reception portion substrate holding frame 103 or thelight emission portion substrate holding frame 104 is in indirectcontact with the main frame 101 through another member, the other memberis preferably a member of a metal material or the like having excellentthermal conductivity.

In addition, the main frame 101 includes the main plate portion 101 athat forms a frame surface extending in the Y axis direction and the Zaxis direction, in other words, a frame surface wide in the Y-Z plane,as illustrated in FIG. 18 . Thus, a surface area of the main frame 101is increased, and a heat dissipation efficiency is improved.

In addition, as described above with reference to FIG. 7 , the frameassembly 100 includes the battery holding portion 100 a that has a shapesurrounding the battery 17. Thus, heat generated from the battery 17 istransferred to the battery holding portion 100 a and efficientlydissipates through the main frame 101 and the battery holding frame 102.

In addition, the battery holding portion 100 a includes the batterysupport portion 102 a as the first wall portion that supports thebattery 17 from below, and the panel substrate support portion 101 b asthe second wall portion that faces the battery support portion 102 a andforms an upper surface side wall portion of the battery holding portion100 a. In addition, the battery holding portion 100 a includes thesubplate portion 101 c as the third wall portion and the second frameportion 102 c as the fourth wall portion that are positioned with thebattery 17 interposed therebetween in the X axis direction. With such aconfiguration, heat generated from the battery 17 efficientlydissipates.

In addition, in the present embodiment, the panel substrate 65 and thebattery control substrate 70 are in direct contact with the main frame101. Thus, heat generated from the panel substrate 65 and the batterycontrol substrate 70 is transferred to the main frame 101 and favorablydissipates.

The panel substrate 65 and the battery control substrate 70 may beconfigured to be in indirect contact with the main frame 101 throughanother member. Here, the other member is preferably a member of a metalmaterial or the like having excellent thermal conductivity.

Configuration of Shutter Unit

Next, the shutter unit 110 disposed in a bottom portion of the apparatusmain body 50 will be described. As illustrated in FIG. 30 to FIG. 34 ,the shutter unit 110 is a unit body that is configured to include theshutter holding member 111, the shutter member 112, and the link member113. In the present embodiment, the shutter holding member 111, theshutter member 112, and the link member 113 are formed of a resinmaterial.

The link member 113 is relatively rotatably coupled to the shutterholding member 111 through a coupling shaft 114 that has a center axisparallel to the X axis direction. A first guide shaft 121 and a secondguide shaft 122 are disposed on a +X direction side surface and a −Xdirection side surface of the shutter holding member 111. In addition, athird guide shaft 123 is disposed on a +X direction side surface and a−X direction side surface of the link member 113.

As illustrated in FIG. 32 , FIG. 33 , and FIG. 35 , a first lower guideportion 21 c, a second lower guide portion 21 d, and a third lower guideportion 21 e are formed in the Y axis direction in a +X direction endportion and a −X direction end portion of the opening portion formingmember 21. The first lower guide portion 21 c and the second lower guideportion 21 d have a shape in which a −Y direction end portion thereof iscurved to the +Z direction in the −Y direction. In addition, the thirdlower guide portion 21 e is formed into an inclined shape that extendsslightly to the −Z direction in the −Y direction.

On a +X direction end portion and a −X direction end portion of thebottom casing 53, as illustrated in FIG. 35 , a first upper guideportion 53 c is formed with the first guide shaft 121 interposed betweenthe first upper guide portion 53 c and the first lower guide portion 21c. FIG. 35 illustrates the first upper guide portion 53 c that ispositioned in the +X direction end portion.

Similarly, on the +X direction end portion and the −X direction endportion of the bottom casing 53, a second upper guide portion 53 d isformed with the second guide shaft 122 interposed between the secondupper guide portion 53 d and the second lower guide portion 21 d. FIG.35 illustrates the second upper guide portion 53 d that is positioned inthe +X direction end portion.

In addition, similarly, on the +X direction end portion and the −Xdirection end portion of the bottom casing 53, a third upper guideportion 53 e is formed with the third guide shaft 123 interposed betweenthe third upper guide portion 53 e and the third lower guide portion 21e. FIG. 35 illustrates the third upper guide portion 53 e that ispositioned in the +X direction end portion.

In such a manner, the first guide shaft 121, the second guide shaft 122,and the third guide shaft 123 are in a state of being interposed betweenthe opening portion forming member 21 and the bottom casing 53 in the Zaxis direction, and are guided in the Y axis direction by the openingportion forming member 21 and the bottom casing 53.

The first guide shaft 121 and the second guide shaft 122 are disposed inthe shutter holding member 111. Thus, a movement trajectory of theshutter holding member 111 is defined by the first lower guide portion21 c and the first upper guide portion 53 c, and the second lower guideportion 21 d and the second upper guide portion 53 d.

In addition, the third guide shaft 123 is disposed in the link member113. Thus, a movement trajectory of the link member 113 is defined bythe third lower guide portion 21 e and the third upper guide portion 53e, and the coupling shaft 114 in the shutter holding member 111.

A +Y direction movement limit, that is, the closed position, of theshutter unit 110 is defined by causing the first guide shaft 121 to abuton a movement regulation portion 53 f formed in the bottom casing 53. Inaddition, a −Y direction movement limit, that is, the open position, ofthe shutter unit 110 is defined by causing the first guide shaft 121 toabut on a movement regulation portion 21 f formed in the opening portionforming member 21. In the present embodiment, the second guide shaft 122and the third guide shaft 123 do not define a Y direction movement limitof the shutter unit 110.

Next, as illustrated in FIG. 31 , FIG. 33 , FIG. 34 , FIG. 36 , and FIG.37 , a −Z direction surface of a part in which the opening portion 21 ais formed in the opening portion forming member 21 is denoted byreference sign 21 g. Hereinafter, the surface will be referred to as ashutter facing surface 21 g. The shutter facing surface 21 g is a planarsurface that has a ring shape in plan view.

As illustrated in FIG. 34 , the shutter facing surface 21 g ispositioned slightly further in the +Z direction than the bottom surface50 f, that is, does not protrude further in the −Z direction than thebottom surface 50 f. In the shutter unit 110 at the closed position, asillustrated in FIG. 34 , the shutter holding member 111 protrudesfurther in the −Z direction than the bottom surface 50 f.

In addition, in the shutter unit 110 at the closed position, the linkmember 113 does not protrude further in the −Z direction than at leastthe shutter holding member 111, and most of the link member 113 does notprotrude from the bottom surface 50 f.

As illustrated in FIG. 35 , the movement trajectory of the shutterholding member 111 is defined by the first lower guide portion 21 c andthe first upper guide portion 53 c, and the second lower guide portion21 d and the second upper guide portion 53 d. Thus, as is apparent fromFIG. 35 , when the shutter holding member 111 moves toward the openposition from the closed position, the shutter holding member 111 isdisplaced in the −Y direction and significantly moves in the +Zdirection in a second half of the displacement. Accordingly, when theshutter unit 110 is at the open position, the shutter holding member 111is in a state of not protruding in the −Z direction from the bottomsurface 50 f as illustrated in FIG. 31 and FIG. 20 .

In addition, when the shutter holding member 111 moves in the +Zdirection, the link member 113 consequently rotates relative to theshutter holding member 111 through the coupling shaft 114 as illustratedby a change from FIG. 36 to FIG. 37 . Even when the shutter unit 110 isat the open position, the link member 113 does not protrude further inthe −Z direction than the shutter holding member 111 as illustrated inFIG. 37 . In addition, when the shutter unit 110 is at the openposition, the entire link member 113 is in a state of not protruding inthe −Z direction from the bottom surface 50 f as illustrated in FIG. 20.

Next, in the bottom frame 105, as illustrated in FIG. 15 , shaftreception portions 105 c are formed at an interval in the X axisdirection. A spring hook shaft 115 is supported by the shaft receptionportion 105 c as illustrated in FIG. 32 , FIG. 34 , FIG. 36 , and FIG.37 . One end of the torsion spring 117 that is one example of a springmember is rotatably fixed to the spring hook shaft 115. A tip endportion at one end of the torsion spring 117 is formed into a coil shapethrough which the spring hook shaft 115 can pass.

The other end of the torsion spring 117 is rotatably fixed to the thirdguide shaft 123 disposed in the link member 113. A tip end portion atthe other end of the torsion spring 117 is formed into a coil shapethrough which the third guide shaft 123 can pass.

As described above, the torsion spring 117 can rotate in the Y-Z plane,in other words, can change a posture.

When the shutter unit 110 is at the closed position, the external forceF provided to the third guide shaft 123, that is, the shutter unit 110,by the torsion spring 117 includes a −Z direction component and a +Ydirection component as illustrated in FIG. 34 . Accordingly, asillustrated by arrow Fy, the torsion spring 117 presses the shutter unit110 in the +Y direction, that is, presses the shutter unit 110 towardthe closed position. Accordingly, the shutter unit 110 is held at theclosed position.

FIG. 36 illustrates a state where the shutter unit 110 moves in the −Ydirection from the closed position by a predetermined amount. The +Ydirection component of the pressing force F with which the torsionspring 117 presses the shutter unit 110 is decreased as the shutter unit110 is displaced to a neutral position, described later, from the closedposition. Eventually, a component of the force in the Y axis directionbecomes zero, and only the −Z direction component remains. At thispoint, the torsion spring 117 is in a state of not pressing the shutterunit 110 in any of the +Y direction and the −Y direction. Hereinafter,the position of the shutter unit 110 in this state will be referred toas the neutral position.

Even when the shutter unit 110 is displaced to the neutral position fromthe open position, the component of the pressing force F in the Y axisdirection is also decreased and eventually becomes zero.

When the shutter unit 110 is displaced in the −Y direction from theneutral position, that is, displaced toward the open position, thepressing force F with which the torsion spring 117 presses the shutterunit 110 includes the −Y direction component. This −Y directioncomponent is increased as the shutter unit 110 is displaced toward theopen position. Accordingly, as illustrated in FIG. 37 , when the shutterunit 110 is at the open position, the pressing force F with which thetorsion spring 117 presses the shutter unit 110 includes a pressingforce Fy of the −Y direction component, and the shutter unit 110 is heldat the open position.

Next, the shutter member 112 is disposed on a +Z direction side of theshutter holding member 111. As illustrated in FIG. 34 , FIG. 36 , FIG.37 , and FIG. 39 , a cylinder portion 112 e is formed on a −Z directionside of the shutter member 112. A recessed portion 111 c that receivesthe cylinder portion 112 e is formed in the shutter holding member 111(refer to FIG. 40 as well).

In addition, as illustrated in FIG. 43 , a white plate 125 that is areflection reference surface is disposed on a +Z direction side of theshutter member 112. In order to acquire a reflection reference value,the white plate 125 is white such that reflectance is close to 100%.

The white plate 125 is positioned in a center region of the shuttermember 112 in a planar direction, that is, in the X-Y plane. Here,positioning the white plate 125 in the center region of the shuttermember 112 in the planar direction means that a center position of theshutter member 112 in the planar direction is included within a range ofthe white plate 125. The center position of the shutter member 112 inthe planar direction is a center position of the shutter member 112 inthe Y axis direction and the X axis direction and, in the presentembodiment, approximately coincides with the optical axis CL or is nearat least the optical axis CL.

The shutter member 112 is disposed to be displaceable in the Z axisdirection, that is, in a direction of approaching to and separating fromthe opening portion 21 a, with respect to the shutter holding member111.

More specifically, as illustrated in FIG. 38 and FIG. 39 , on a +Xdirection side surface and a −X direction side surface of the shuttermember 112, protruding portions 112 d are disposed at an interval in theY axis direction. Meanwhile, on the +X direction side surface and the −Xdirection side surface of the shutter holding member 111, openingportions 111 b that receive the protruding portions 112 d are disposedat an interval in the Y axis direction.

A size of the opening portions 111 b in the Z axis direction is greaterthan a size of the protruding portions 112 d in the Z axis direction.Accordingly, the protruding portions 112 d are movable in the Z axisdirection in a state of being inserted into the opening portions 111 b.Accordingly, the shutter member 112 is held in the shutter holdingmember 111 in a movable manner in the Z axis direction.

As illustrated in FIG. 40 , a plate spring 118 as a pressing member thatpresses the shutter member 112 in the +Z direction, that is, toward theopening portion 21 a, is disposed in the shutter holding member 111. Theplate spring 118 includes a plurality of pressing portions that pressthe shutter member 112. Specifically, the plate spring 118 includesthree pressing portions 118 a. The plurality of pressing portions 118 aare arranged at almost equal intervals at positions around the openingportion 21 a.

When the shutter unit 110 is at the closed position, as illustrated inFIG. 34 , a contact surface 112 a that faces the shutter facing surface21 g in the shutter member 112 is in close contact with the shutterfacing surface 21 g by a pressing force of the plate spring 118. Thecontact surface 112 a has a ring shape around the opening portion 21 a,that is, along the shutter facing surface 21 g (refer to FIG. 43 ).Pressing the contact surface 112 a against the shutter facing surface 21g closes the opening portion 21 a, and entrance of dust or the likeinside the apparatus through the opening portion 21 a is suppressed.

Next, as illustrated in FIG. 31 , FIG. 33 , FIG. 41 , and FIG. 42 ,first protruding ribs 21 b are formed in the Y axis direction on bothsides of the shutter facing surface 21 g in the X axis direction. Thefirst protruding ribs 21 b are ribs that protrude in the −Z directionfrom the opening portion forming member 21.

In addition, in the shutter member 112, as illustrated in FIG. 43 ,second protruding ribs 112 b are formed in the Y axis direction on bothsides of the contact surface 112 a in the X axis direction. The secondprotruding ribs 112 b are ribs that protrude toward the opening portionforming member 21 from the shutter member 112.

The second protruding ribs 112 b are formed at positions at which thesecond protruding ribs 112 b can abut on the first protruding ribs 21 b.As illustrated in FIG. 41 , when the shutter unit 110 is at the closedposition, the second protruding ribs 112 b are positioned in the +Ydirection with respect to the first protruding ribs 21 b and do not abuton the first protruding ribs 21 b.

Inclined surfaces 112 c that extend to the −Z direction in the −Ydirection are formed in −Y direction end portions of the secondprotruding ribs 112 b. In addition, inclined surfaces 21 h that extendto the +Z direction in the +Y direction are formed in +Y direction endportions of the first protruding ribs 21 b. When the shutter unit 110 isat the closed position, the inclined surfaces 112 c face the inclinedsurfaces 21 h.

When the shutter unit 110 is displaced toward the open position fromthis state, the second protruding ribs 112 b abut on the firstprotruding ribs 21 b, and the second protruding ribs 112 b are in astate of overlapping with the first protruding ribs 21 b in the Z axisdirection as illustrated by a change from FIG. 41 to FIG. 42 .Accordingly, the shutter member 112 moves in the −Z direction againstthe pressing force of the plate spring 118, and a gap is formed betweenthe shutter facing surface 21 g and the contact surface 112 a asillustrated in FIG. 36 .

In such a manner, the first protruding ribs 21 b and the secondprotruding ribs 112 b constitute a movement section 119 that, when theshutter unit 110 at the closed position is displaced toward the openposition, moves the shutter member 112 in a direction in which theshutter member 112 is separated from the opening portion forming member21.

Consequently, wear of the shutter facing surface 21 g can be minimized.

Next, as illustrated in FIG. 43 to FIG. 45 , a window portion 112 f isformed in the shutter member 112, and a magnet 127 is disposed to beexposed through the window portion 112 f. The magnet 127 is fixed to theshutter holding member 111 by an adhesive material or a double-sidedtape.

The magnetic sensor 128 is disposed on the lower surface of the lightemission portion substrate 85.

When the shutter unit 110 is at the open position, as illustrated inFIG. 44 , the magnet 127 is at a position at which the magnet 127overlaps with the magnetic sensor 128 in the Y axis direction. Thisstate is a state where a straight line distance between the magnet 127and the magnetic sensor 128 is the shortest.

Meanwhile, when the shutter unit 110 is at the closed position, asillustrated in FIG. 45 , the straight line distance between the magnet127 and the magnetic sensor 128 is increased, compared to when theshutter unit 110 is at the open position. This state is a state where astraight line distance between the magnet 127 and the magnetic sensor128 is the longest.

With such a configuration, the magnetic sensor 128 can be arranged at aposition separated from the opening portion 21 a, and size increase ofthe apparatus caused by arranging the magnetic sensor 128 close to theopening portion 21 a can be suppressed.

The magnetic sensor 128 is a magnetic sensor that changes the detectionsignal depending on magnetic strength. When the shutter unit 110 is atthe open position, the magnetic sensor 128 transmits a High detectionsignal to the MCU 10 (refer to FIG. 1 ). In addition, when the shutterunit 110 is at the closed position, the magnetic sensor 128 transmits aLow detection signal to the MCU 10 (refer to FIG. 1 ). That is, themagnetic sensor 128 is a detection section that changes a detectionsignal in accordance with displacement of the shutter unit 110.

Accordingly, the MCU 10 can detect whether the shutter unit 110 is atthe closed position or the open position.

As described above, the shutter unit 110 is configured to include theshutter member 112 that closes the opening portion 21 a when the shutterunit 110 is at the closed position, the shutter holding member 111 thatholds the shutter member 112 such that the shutter member 112 can bedisplaced in a direction of approaching to or separating from theopening portion 21 a, and the plate spring 118 that is one example ofthe pressing member which presses the shutter member 112 toward theopening portion 21 a.

Accordingly, even when a manufacturing error or an assembly error of apart, or wear or the like accompanied by use occurs, occurrence of a gapbetween the shutter member 112 and the opening portion 21 a can besuppressed by pressing the shutter member 112 toward the opening portion21 a. Consequently, entrance of dust or the like into the openingportion 21 a can be favorably suppressed.

In addition, the plate spring 118 presses the shutter member 112 by theplurality of pressing portions 118 a, that is, at a plurality ofpositions around the opening portion 21 a. Thus, pressing the shuttermember 112 in a biased manner to a specific position in the openingportion 21 a is suppressed, and the opening portion 21 a can befavorably closed by the shutter member 112.

In addition, a movement section 119 that, when the shutter unit 110 atthe closed position is displaced toward the open position, moves theshutter member 112 in a direction in which the shutter member 112 isseparated from the opening portion forming member 21 is disposed.Accordingly, wear of the shutter facing surface 21 g that is a partforming the opening portion 21 a in the opening portion forming member21, and the contact surface 112 a that is a part closing the openingportion 21 a in the shutter member 112 is suppressed. Consequently, aconcern that a gap occurs between the opening portion 21 a and theshutter member 112 and dust or the like enters can be suppressed.

In addition, the movement section 119 is configured to include the firstprotruding ribs 21 b that are formed in the opening portion formingmember 21 and protrude toward the shutter member 112, and the secondprotruding ribs 112 b that are formed in the shutter member 112 andprotrude toward the opening portion forming member 21. When the shutterunit 110 is at the closed position, the first protruding ribs 21 b arein a state of non-contact with the second protruding ribs 112 b. Whenthe shutter unit 110 at the closed position is displaced toward the openposition, the second protruding ribs 112 b moves over the firstprotruding ribs 21 b and causes the shutter member 112 to move in adirection of separating from the opening portion forming member 21. Withsuch a configuration, the movement section 119 can be configured at alow cost.

In addition, the shutter unit 110 includes the link member 113 that ispositioned further on an open position side than the shutter holdingmember 111 and is relatively rotatably coupled to the shutter holdingmember 111. The shutter holding member 111 in a state of protruding fromthe bottom surface 50 f when the shutter unit 110 is at the closedposition, and not protruding from the bottom surface 50 f when theshutter unit 110 is at the open position. By rotating the link member113 relative to the shutter holding member 111, a state where the linkmember 113 does not protrude from the bottom surface 50 f more than theshutter holding member 111 is maintained regardless of the position ofthe shutter unit 110.

Accordingly, size reduction of the apparatus particularly when theshutter unit 110 is at the closed position can be achieved, compared toa configuration in which the shutter holding member 111 is integratedwith the link member 113.

In addition, the torsion spring 117 that presses the link member 113toward the open position and the closed position is included, and thetorsion spring 117 changes a posture in accordance with displacement ofthe shutter unit 110. Accordingly, when the shutter unit 110 is furtheron a closed position side than the neutral position, the torsion spring117 presses the link member 113 toward the closed position (refer toFIG. 34 ). In addition, when the shutter unit 110 is further on an openposition side than the neutral position, the torsion spring 117 pressesthe link member 113 toward the open position (refer to FIG. 36 and FIG.37 ). With such a configuration, a section that maintains the shutterunit 110 at the closed position and the open position can be configuredat a low cost.

FIG. 46 schematically illustrates the position of the shutter unit 110.A position Ya1 illustrates the closed position of the shutter unit 110.A position Ya2 illustrates the open position. A position Yac illustratesthe neutral position. Reference sign A1 denotes a movement range of theshutter unit 110 between the closed position Ya1 and the neutralposition Yac. Reference sign A2 denotes the movement range of theshutter unit 110 between the open position Ya2 and the neutral positionYac.

Here, due to friction or the like between the first guide shaft 121, thesecond guide shaft 122, and the third guide shaft 123, and the openingportion forming member 21 and the bottom casing 53 as described withreference to FIG. 35 , a state where the shutter unit 110 does not moveand stops may be maintained even when the shutter unit 110 is slightlyfurther on a closed position Ya1 side than the neutral position Yac.Similarly, even when the shutter unit 110 is slightly further on an openposition Ya2 side than the neutral position Yac, a state where theshutter unit 110 does not move and stops may be maintained.

In FIG. 46 , a range illustrated by a range K is a region in which astate where the shutter unit 110 stops in such a manner is maintained.Hereinafter, this region will be referred to as a stoppage region K ofthe shutter unit 110.

Next, as described above, the white plate 125 that forms the reflectionreference surface used as a reference of reflectance is disposed at aposition facing the opening portion 21 a in the shutter member 112.

The shutter member 112 has a configuration in which the shutter member112 is pressed toward the opening portion 21 a by the plate spring 118.Thus, a position or a direction of the white plate 125 is unlikely tovary, and an appropriate reference value can be obtained.

The shutter unit 110 and configurations related thereto can be modifiedas illustrated in FIG. 47 to FIG. 50 . In FIG. 47 to FIG. 50 , the sameconfigurations as already described configurations are designated by thesame reference signs, and duplicate descriptions will be avoided below.

In FIG. 47 and FIG. 48 , a shutter unit 110A is configured to include ashutter holding member 111A, a link member 113A, and a second linkmember 130. The shutter holding member 111A and the link member 113A arecoupled to be relatively rotatable through the coupling shaft 114. Thelink member 113A and the second link member 130 are coupled to berelatively rotatable through a second coupling shaft 131.

A rotation shaft 132 that is parallel to the X axis direction issupported by an opening portion forming member 21A, and the second linkmember 130 is disposed to be rotatable about the rotation shaft 132 inthe Y-Z plane. In the opening portion forming member 21A, torsionsprings 133 are disposed at an interval in the X axis direction. Oneends of the torsion springs 133 are rotatably hooked to a part of theopening portion forming member 21A, and the other ends of the torsionsprings 133 are hooked to the second link member 130.

FIG. 47 illustrates a state where the shutter unit 110A is at the closedposition, and FIG. 48 illustrates a state where the shutter unit 110A isat the open position. As illustrated by a change from FIG. 47 to FIG. 48or a change from FIG. 48 to FIG. 47 , in accordance with displacement ofthe shutter unit 110A, the shutter holding member 111A and the linkmember 113A relatively rotate, and the link member 113A and the secondlink member 130 relatively rotate.

At this point, the torsion spring 133 changes a posture in the samemanner as the torsion spring 117 (refer to FIG. 32 ). Accordingly, whenthe shutter unit 110A is between the closed position and the neutralposition, the torsion spring 133 presses the shutter unit 110A towardthe closed position. In addition, when the shutter unit 110A is betweenthe open position and the neutral position, the torsion spring 133presses the shutter unit 110A toward the open position.

Next, in FIG. 49 and FIG. 50 , a shutter unit 110B is configured toinclude a shutter holding member 111B and a link member 113B. Theshutter holding member 111B and the link member 113B are coupled to berelatively rotatable through a first coupling portion 140.

A second coupling portion 141 that extends in the X axis direction isformed in the link member 113B. A coupling member 142 engages with thesecond coupling portion 141 in a slidable manner in the X axisdirection.

A rotation shaft 144 is integrated with an opening portion formingmember 21B. In the rotation shaft 144, an arm member 143 is disposed tobe rotatable in the X-Y plane. The arm member 143 and the couplingmember 142 are coupled to be relatively rotatable through a link shaft143 a that has a center axis parallel to the Z axis direction. A torsionspring, not illustrated, that generates a spring force between theopening portion forming member 21B and the arm member 143 is disposed inthe +Z direction with respect to the arm member 143.

FIG. 49 illustrates a state where the shutter unit 110B is at the closedposition, and FIG. 50 illustrates a state where the shutter unit 110B isat the open position. As illustrated by a change from FIG. 49 to FIG. 50or a change from FIG. 50 to FIG. 49 , the shutter holding member 111Band the link member 113B relatively rotate in accordance withdisplacement of the shutter unit 110B.

In addition, the arm member 143 rotates, and consequently, the armmember 143 and the coupling member 142 relatively rotate. At this point,the coupling member 142 causes the second coupling portion 141 to slidein the X axis direction.

The torsion spring, not illustrated, that is positioned in the +Zdirection with respect to the arm member 143 changes the posture inaccordance with rotation of the arm member 143. Accordingly, when theshutter unit 110B is between the closed position and the neutralposition, the torsion spring presses the shutter unit 110B toward theclosed position. In addition, when the shutter unit 110B is between theopen position and the neutral position, the torsion spring presses theshutter unit 110B toward the open position.

The shutter unit 110 and the configurations related thereto can bemodified as described above.

Next, as described above, the color measurement apparatus 1 includes themagnetic sensor 128 that changes the detection signal in accordance withdisplacement of the shutter unit 110. Accordingly, the position of theshutter unit 110 can be perceived, and an appropriate controlcorresponding to the position of the shutter unit 110 can be performed.

In addition, the magnetic sensor 128 is a sensor that changes thedetection signal depending on the magnetic strength. Thus, an opening orthe like for transmitting detection light as in an optical sensor doesnot need to be dedicatedly disposed, and a decrease in airtightness ofthe apparatus caused by forming an extra opening can be avoided.

However, as a detection section for detecting the position of theshutter unit 110, a non-contact type sensor of other types such as anoptical sensor, an electrostatic capacitive proximity sensor, and aninductive proximity sensor or a contact type sensor can also be used.

Hereinafter, a control performed by the MCU 10 (refer to FIG. 1 ) thatis a control portion receiving the detection signal from the magneticsensor 128 will be described with reference to FIG. 51 to FIG. 53 .

In FIG. 51 , when the power button 55 (refer to FIG. 5 and the like) ispushed in a state where power is ON, that is, when a power OFFinstruction for the apparatus is received (Yes in step S101), and theshutter unit 110 is at the closed position (Yes in step S102), the MCU10 transitions to a power OFF process for the apparatus (step S103).

Meanwhile, when the shutter unit 110 is at the open position (No in stepS102), a transition to power OFF is suspended. In the present example,an alert indicating that the shutter unit 110 is at the open position isdisplayed on the display portion 15 (refer to FIG. 5 and the like) (stepS104).

Accordingly, the apparatus is not powered OFF in a state where theshutter unit 110 is at the open position, and entrance of dust or thelike inside the apparatus through the opening portion 21 a in a statewhere the apparatus is powered OFF can be suppressed.

In addition, since the alert indicating that the shutter unit 110 is atthe open position is displayed on the display portion 15, usability isimproved. For example, a message such as “Shutter is open. Pleaseclose.” can be displayed as the alert indicating that the shutter unit110 is at the open position.

Next, in FIG. 52 , when the MCU 10 determines that a timing at which thereference value is acquired using the white plate 125 (refer to FIG. 43and the like) is reached (Yes in step S201), the MCU 10 determineswhether or not the shutter unit 110 is at the closed position (stepS202). Consequently, when the shutter unit 110 is at the closed position(Yes in step S202), a reference value acquisition process is executed(step S203). Meanwhile, when the shutter unit 110 is at the openposition (No in step S202), acquisition of the reference value issuspended. In this case, in the present example, the alert indicatingthat the shutter unit 110 is at the open position is displayed on thedisplay portion 15 (refer to FIG. 5 and the like) (step S204).Accordingly, the reference value can be appropriately acquired using thewhite plate 125.

Examples of the timing at which the reference value is acquired includewhen the power button 55 (refer to FIG. 5 and the like) is pushed from apower OFF state, that is, when a power ON instruction for the apparatusis received, and when a predetermined time period elapses in a power ONstate of the apparatus.

Next, in FIG. 53 , when the decision button 54 (refer to FIG. 5 and thelike) is pushed, that is, when a color measurement execution instructionis received (Yes in step S301), and the shutter unit 110 is at the openposition (Yes in step S302), the MCU 10 executes a color measurementprocess (step S303).

Meanwhile, when the shutter unit 110 is at the closed position (No instep S302), a transition to power OFF is suspended. In the presentexample, an alert indicating that the shutter unit 110 is at the closedposition is displayed on the display portion 15 (refer to FIG. 5 and thelike) (step S304). By such a control, an appropriate color measurementvalue can be acquired.

When the color measurement execution instruction is received (Yes instep S301), and the shutter unit 110 is at the open position (Yes instep S302), the color measurement process may be executed (step S303).When the shutter unit 110 is at the closed position (No in step S302),the reference value may be acquired using the white plate 125, and then,a transition may be made to the process in step S304.

In addition, in FIG. 46 , in a displacement region (A1+A2) of theshutter unit 110, a region B1 in which the magnetic sensor 128 transmitsthe detection signal indicating the closed position of the shutter unit110 is set by disposing a margin M on the closed position Ya1 side fromthe neutral position Yac. In FIG. 46 , a position Ybc illustrates aposition at which the detection signal of the magnetic sensor 128 isswitched. In the region B1, the detection signal indicating that theshutter unit 110 is at the closed position is transmitted. In a regionB2, the detection signal indicating that the shutter unit 110 is at theopen position is transmitted.

Particularly, in the present embodiment, the region B1 is set further onthe closed position Ya1 side than the stoppage region K of the shutterunit 110.

Accordingly, when the magnetic sensor 128 transmits the detection signalindicating the closed position of the shutter unit 110, the shutter unit110 is securely at the closed position. Accordingly, there is no concernfor a determination that the shutter unit 110 is at the closed positioneven when the shutter unit 110 is at an intermediate position.Furthermore, the reference value can be securely acquired using thewhite plate 125.

The present disclosure is not limited to each embodiment describedabove, and various modifications can be made within the scope of thedisclosure disclosed in the claims. Such modifications also fall withinthe scope of the present disclosure.

For example, while the color measurement apparatus 1 incorporates thebattery 17 in the embodiment, the battery 17 may be configured to bedetachable. That is, the color measurement apparatus 1 may be configuredto not incorporate the battery 17. In addition, in this case, thebattery 17 may be a primary battery that is not repeatedly charged anddischarged.

In addition, in the present embodiment, the incident light processingportion 2 is configured to include the optical filter device 3 and thelight reception portion 4, and the optical filter device 3 is a variablewavelength Fabry-Perot etalon that transmits a predetermined wavelengthcomponent of the incident light. However, the present disclosure is notlimited thereto. For example, a spectroscopic method that uses adiffraction lattice may be used as a spectroscopic method. In addition,an apparatus configuration that employs a stimulus value direct readingmethod of directly measuring three stimulus values of base colors as acolor measurement principle may be available.

In addition, while the LED is used as the light emission element used inthe light emission portion 9 in the present embodiment, the presentdisclosure is not limited thereto. For example, a xenon lamp may beused.

What is claimed is:
 1. A color measurement apparatus comprising: anopening portion forming member that is a member in which an openingportion for causing light arriving from a measurement target to enterinside the apparatus is formed, and that is arranged on a bottom surfaceat a time of measurement performed by the apparatus; an incident lightprocessing portion that processes light incident through the openingportion; and an operation portion that is positioned on an upper surfacewhich is a surface on an opposite side from the bottom surface, and thatreceives various operations, wherein in a view from a first directionthat is a vertical direction intersecting with the bottom surface andthe upper surface which is the surface on the opposite side from thebottom surface, the opening portion and the operation portion have anoverlapping part.
 2. The color measurement apparatus according to claim1, wherein the operation portion includes a decision button thatreceives at least one of decision of a measurement condition andexecution of measurement, and in a view from the first direction, acenter position of the opening portion coincides with a center positionof the decision button.
 3. The color measurement apparatus according toclaim 2, wherein a cross button for selecting various items is arrangedaround the decision button, and a mark line is disposed in the crossbutton.
 4. The color measurement apparatus according to claim 1, whereinthe operation portion is configured to include a power button and allbuttons related to measurement on the upper surface.
 5. The colormeasurement apparatus according to claim 1, wherein the upper surfaceincluding the operation portion is formed into a planar shape.
 6. Thecolor measurement apparatus according to claim 1, further comprising: afirst circuit substrate that includes the incident light processingportion; and the display portion that is positioned on the upper surfaceand performs various kinds of display, wherein in a view from the firstdirection, the display portion and the first circuit substrate have anoverlapping part.
 7. The color measurement apparatus according to claim1, further comprising: a battery that supplies power to the incidentlight processing portion, wherein the battery has a shape that extendsin a second direction which is a direction intersecting with the firstdirection and is a longitudinal direction of the apparatus in a viewfrom the first direction, and both end portions of the battery in thesecond direction face a side wall inner surface, in the seconddirection, of a casing that forms an outline of the apparatus.
 8. Thecolor measurement apparatus according to claim 7, wherein the casingincludes a recessed portion for grip on a side wall in a third directionthat is a direction orthogonal to the second direction and is a shortdirection of the apparatus in a view from the first direction, and thebattery and the recessed portion have an overlapping part in a view fromthe third direction.
 9. The color measurement apparatus according toclaim 1, wherein the incident light processing portion includes avariable wavelength optical filter that transmits a predeterminedwavelength component of incident light, and a light reception portionthat receives light transmitted through the optical filter.
 10. Thecolor measurement apparatus according to claim 9, wherein the opticalfilter is a Fabry-Perot etalon.